Haishen3 uses a professional-grade SSD main control chip and the industry's most recent 9X/1XX layer 3D eTLC NAND, with single-disk capacities of up to 8TB.
Product number | H3100 | H3100 | ||||
SSD capacity(TB) | 0.8 | 1.6 | 3.2 | 6.4 | 3.2 | 6.4 |
SSD form | U.2 / AIC | U.2 | ||||
Interface | PCIe 3.0 x 4, NVMe 1.3 | |||||
Flash memory type | 9XL 3D eTLC NAND | 1XXL 3D eTLC NAND | ||||
Read bandwidth(128KB)MB/s | 3500 | 3500 | 3500 | 3500 | 3500 | 3500 |
Write bandwidth(128KB)MB/s | 1350 | 2700 | 3000 | 3000 | 2900 | 3100 |
Random read(4KB)KIOPS | 580 | 820 | 820 | 820 | 820 | 820 |
Random write(4KB)KIOPS | 140 | 240 | 250 | 230 | 260 | 250 |
Power dissipation(Typ./Max)Watt | 7.0/8.5 | 7.5/10 | 8.0/11 | 8.5/12.5 | 9.0/12 | 9.0/12 |
4K Random Latency(Typ.)R/W µs | 85/15 | 81/13 | ||||
4K sequential Latency(Typ.)R/W µs | 15/15 | 14/13 | ||||
SSD life | 3 DWPD | |||||
MTBF | 2 million hours | |||||
UBER | 1 sector per 10^17 bits read | |||||
Supported OS | RHEL, SLES, CentOS, Ubuntu, Windows Server, VMware ESXi | |||||
Certified | FCC, CE, ROHS, REACH, WEEE, PCI express, NVM express |